8-KFinancial Events

HONEYWELL INTERNATIONAL INC 8-K Report, Financial Obligation (May 2, 2006)

Filed May 2, 2006For Securities:HONHONIV

Summary

Honeywell International Inc. (HON) filed an 8-K on May 1, 2006, reporting the execution of a new $2.3 billion Five-Year Credit Agreement on April 27, 2006. This agreement replaces two previous credit facilities totaling $2.3 billion, under which no borrowings were outstanding. The new credit facility provides significant liquidity for general corporate purposes, including support for its commercial paper program, with an option to increase the total commitment to $3 billion. Key features of the new agreement include a sub-limit of $500 million for letters of credit, with approximately $175 million of existing letters of credit being transferred. Notably, the agreement does not contain financial covenants or restrictions on dividend payments. The filing details customary events of default and specific triggers that could lead to termination of lending commitments, such as a change in control of the company.

Key Highlights

  • 1Execution of a new $2.3 billion Five-Year Credit Agreement, effective April 27, 2006.
  • 2The new credit facility replaces prior agreements totaling $2.3 billion, with no outstanding borrowings under the prior facilities.
  • 3The agreement allows for an increase in commitments up to an aggregate of $3 billion.
  • 4Includes a $500 million sub-limit for the issuance of letters of credit.
  • 5The credit facility is intended for general corporate purposes and to support commercial paper issuance.
  • 6Does not contain financial covenants or restrict dividend payments.
  • 7Includes customary events of default and specific change-of-control provisions that could impact lending commitments.

Frequently Asked Questions

The primary purpose of the new $2.3 billion Five-Year Credit Agreement is to provide Honeywell with enhanced financial flexibility for general corporate purposes, including the support of its commercial paper program.

No, the filing explicitly states that the Credit Agreement does not restrict Honeywell's ability to pay dividends and does not contain financial covenants. This suggests continued financial flexibility for the company.

The facility fee, interest rate margins, and letter of credit issuance fee are subject to change based on Honeywell's long-term debt ratings. However, the Credit Agreement itself is not subject to termination based upon a decrease in debt ratings or a Material Adverse Change, which provides stability to the facility.

Banks' commitments to lend additional funds or issue letters of credit can be terminated under specific conditions, including the acquisition of 30% or more of Honeywell's voting stock by a single entity or group, or if a majority of the Board of Directors changes during any 12-month period. Customary events of default, such as non-payment or bankruptcy, would also trigger potential cessation of borrowing.