8-KMaterial AgreementsFinancial EventsExhibits & Filings

HONEYWELL INTERNATIONAL INC 8-K Report, Material Agreement (Feb 20, 2018)

Filed February 20, 2018For Securities:HONHONIV

Summary

Honeywell International Inc. (HON) filed an 8-K on February 20, 2018, primarily to disclose the entry into a $1.5 billion 364-Day Credit Agreement. This facility, established on February 16, 2018, is intended for general corporate purposes and matures on February 15, 2019. Notably, the agreement does not include financial covenants or restrict dividend payments, providing operational flexibility for Honeywell. The credit agreement does contain customary conditions and events of default that could prevent further borrowings or trigger repayment of outstanding amounts.

Key Highlights

  • 1Honeywell entered into a $1.5 billion 364-Day Credit Agreement on February 16, 2018.
  • 2The credit facility is for general corporate purposes.
  • 3The agreement matures on February 15, 2019.
  • 4The credit agreement does not contain financial covenants, offering flexibility.
  • 5Dividend payments are not restricted by this agreement.
  • 6Borrowings are subject to customary conditions and events of default, including cross-defaults and change of control provisions.
  • 7Interest rates are tied to the Base Rate or Eurocurrency Rate plus an Applicable Margin, which varies based on credit ratings and credit default swap spreads.

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