8-KMaterial AgreementsFinancial EventsExhibits & Filings

QUALCOMM INC/DE 8-K Report, Material Agreement (Jun 13, 2018)

Filed June 13, 2018For Securities:QCOM

Summary

Qualcomm Incorporated (QCOM) announced on June 13, 2018, that it entered into Amendment No. 2 to its Credit Agreement, dated June 11, 2018. This amendment significantly increases the aggregate term loan commitments from $3 billion to $7 billion. The primary purpose of this expanded credit facility is to help finance Qualcomm's proposed acquisition of NXP Semiconductors N.V. This financial move underscores Qualcomm's commitment to the NXP acquisition and signals its readiness to secure the necessary capital. Investors should note that the additional term loan commitments carry the same terms and conditions as the existing ones, suggesting a consistent financial strategy. This filing is a key update regarding the financing structure for one of Qualcomm's most significant strategic initiatives.

Key Highlights

  • 1Qualcomm amended its Credit Agreement on June 11, 2018.
  • 2The amendment increases aggregate term loan commitments from $3 billion to $7 billion.
  • 3The expanded credit facility is intended to help finance the acquisition of NXP Semiconductors N.V.
  • 4The additional term loan commitments have identical terms and conditions to existing commitments.
  • 5This filing confirms the company's progress in securing financing for the NXP acquisition.

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