Summary
TE Connectivity plc (TEL), previously operating as Tyco Electronics Ltd., announced on December 20, 2010, through its wholly-owned subsidiary Tyco Electronics Group S.A. (TEGSA), the successful issuance of $250 million in 4.875% Senior Notes due January 15, 2021. These notes are fully guaranteed by Tyco Electronics Ltd. and were issued under a registration statement filed with the SEC. The net proceeds, approximately $246.9 million after deducting the underwriters' discount, will be utilized for general corporate purposes, which may include debt repayment. The issuance details highlight the company's strategy to strengthen its financial position and potentially reduce existing debt obligations. The notes are unsecured senior obligations of TEGSA, ranking equally with its other senior debt, and are guaranteed by Tyco Electronics Ltd. on an unsecured senior basis. The terms of the indenture include provisions for redemption at the company's option, limitations on liens and sale-leaseback transactions, and a change of control provision that would trigger a repurchase offer under specific circumstances, including a downgrade to below investment grade rating.
Key Highlights
- 1TE Connectivity (Tyco Electronics) subsidiary, TEGSA, issued $250 million in 4.875% Senior Notes due January 15, 2021.
- 2Tyco Electronics Ltd. provides a full and unconditional guarantee for the principal and interest payments on the Notes.
- 3Net proceeds from the offering are approximately $246.9 million, intended for general corporate purposes, including potential debt repayment.
- 4The Notes are unsecured senior obligations of TEGSA and rank equally with existing and future senior debt.
- 5The indenture includes covenants that limit TEGSA's ability to create liens and enter into sale-leaseback transactions.
- 6A change of control provision requires TEGSA to offer to repurchase the Notes at 101% of principal if the notes are rated below investment grade by two major rating agencies as a result of the change of control.
- 7The filing details various events of default, including payment defaults, covenant breaches, and bankruptcy events.